PhD
Process Technology
Reliability research at Imec
Imec has always paid a lot of attention to the reliability of the technologies and devices that are being developed, which becomes more and more important for more advanced technologies. At imec 2 reliability groups are active: Device Reliability and Electrical characterization (DRE) and Reliability and modeling (REMO).
The Device Reliability and Electrical characterization (DRE) group is investigating device related failure mechanisms, such as Negative-Bias Temperature Instability, Hot Carrier Degradation and Time-dependent Dielectric Breakdown. Novel characterization techniques to measure the properties of the gate stack (work function, interface traps, energy barrier, etc.) are being developed, as well as optimized acceleration and lifetime prediction methods. These mechanisms are investigated for a broad range of novel technologies such as Multiple gate and strained devices, Ge-III-V based MOSFET’s, nanowire based MOSFET’s etc. Also Electrostatic Discharge protection strategies for these novel technologies and Reliability-Aware design techniques are being investigated.
The reliability & modeling group (REMO) of imec is active in thermo-mechanical modeling (FEM); optical, electrical and thermal functional- and reliability testing; electromigration testing; environmental reliability testing (temperature, humidity, shock, vibration); material analysis ; sample preparation and failure analysis These activities cover a broad application domain Cu/low k; 3D integration; MEMS/NEMS; next generation Si device packaging; flexible and stretchable substrates and package and board.
Responsible scientists: Guido Groeseneken (DRE), Ingrid De Wolf (REMO).