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Leuven, October 20th and 21st 20111st International Workshop on Resistive RAM 

                       

Imec and Stanford NMTRI* are jointly organizing the 1st International Workshop on Resistive RAM, addressing all aspects of RRAM (including oxide-based RRAM, CBRAM, selector, and array considerations). The workshop will be held at Imec, Leuven, Belgium, on October 20th and 21st (Thursday and Friday), 2011, and will be supported by imec’s Center of Advanced Learning in Information Technologies (CALIT).

Resistive memories are seen today as one of the most promising emerging candidates to become a key memory technology of the future, with many potential applications, ranging from replacement of current mass production commodity memories to embedded applications and even creating novel market segments.

The intention is for this workshop to serve as a forum gathering key scientists and technologists working on RRAM, including academia as well as industry, to discuss both the fundamental mechanisms controlling the operation, scalability and reliability as well as technological potential and challenges of these exciting memories.

The workshop will consist of invited talks and panel discussions, as well as a poster session. Participation is by invitation.

*Stanford NMTRI (Nonvolatile Memory Technology Research Initiative) is an industrial affiliate program at Stanford. URL: http://nmtri.stanford.edu/


Speakers, Topics, Abstracts, CV’s

link to Agenda

Thursday, October 20th, 2011 

09.00:Welcome and Opening Remarks
J. A. Kittl/L. Van den Hove (Imec, Belgium)
09.15:Keynote: Resistive Switching Memory (RRAM) – Modeling and Scaling Studies
H. -S. P. Wong (Stanford, USA)
09.55:Keynote: Microscopic Processes in Redox-Based Resistive Switching
R. Waser (Jülich-Aachen Research Alliance-FIT, Germany)
10.35:Coffee Break
10.55:Keynote: Collective motion of nano-filaments in Pt/n-type TiO2/p-type NiO/Pt stacked resistance switching memory
C. S. Hwang (Seoul National University, Korea)
11.35:Resistive Random Access Memory: Technology and Applications
F. Chen (ITRI, Taiwan)
12.00Lunch
13.30:Progress and Challenges on Resistive RAM
J. A. Kittl (Imec, Belgium)
13.55:Modeling filament conduction
R. Degraeve (Imec, Belgium)
14.20Coffee break
14.40Mechanisms and modeling of filamentary switching in bipolar metal-oxide RRAM
D. Ielmini (Politecnico di Milano, Italy)
15.05Oxide-Based RRAM-Unified Physical Mechanism and Implementation for Cell Design Optimization
J. Kang (Peking University, China)
15.30Physical modeling of HfO2 RRAM device operations
L. Larcher (Università di Modena e Reggio Emilia, Italy)
16.00:Poster Session/Reception
18.30:Panel Discussion: “What is the switching mechanism of metal oxide RRAM?”
Panelists: H. Akinaga (AIST, Japan), R. Waser (JARA, Germany), C. S. Hwang (Seoul National University, Korea), D. Ielmini (Politecnico di Milano, Italy), Y. Nishi (Stanford, USA), F. Chen (ITRI, Taiwan), L. Larcher (Università di Modena, Italy)

Friday, October 21st, 2011

09.00:Opportunities and Risks of the Resistive Memory in the Future Memory Market
I. G. Baek (Samsung, Korea)
09.25:Emerging Memory Opportunities, Promise and Challenges
G. Sandhu (Micron, USA)
9.50:Hf-based RRAM: towards 10 nm
B. Govoreanu (Imec, Belgium)
10.15:Coffee Break
10.35:Keynote: Ionic memory
M. Kozicki (Adesto, USA)
11.00:Triode atom-switch
T. Sakamoto (LEAP(NEC), Japan)
11.25:Physics of Ag/GeSx/W CBRAM cells
J. R. Jameson (Adesto, USA)
12.00Lunch
13.30:Tungsten-oxide ReRAM and Cu-based Multiple-layer CBRAM
E. Lee (Macronix,Taiwan)
13.55:Cu-Te based CBRAM
L. Goux (Imec, Belgium)
14.20:Kinetic Monte-Carlo Modeling of Electrochemical Metallization RRAMs
V. Subramanian (U.C. Berkeley, USA)
14.45:RRAM memories for advanced CMOS integration
J.Buckley (CEA-LETI-MINATEC, France)
15.10:ReRAM and CBRAM devices using AlOx and Ge-based materials
S. Maikap (Chang Gung University, China)
15.35Coffee break
15.55SSelector considerations for RRA
G. Spadini (Intel, USA)
16.20Selection devices for Resistive Switching Memories (RRAM)
A. Chen (Global Foundries, USA)
16.45Access Device Options for 3D Crosspoint RRAM Arrays
K. Gopalakrishnan (IBM, USA)
16.45Coffee Break
17.30:Panel Discussion: “Which emerging memory for what applications?”
Panelists: G. Sandhu (Micron, USA), G. Spadini (Intel, USA), T. Sakamoto (NEC, Japan), I. G. Baek (Samsung, Korea),R. Srivastava (Sandisk), R. Liu (Macronix, Taiwan), C. Lam (IBM, USA), N. Derhacobian (Adesto, USA)

Organizing Committee:

Dr. J. A. KittlProf. H.-S. P. WongProf. Y. NishiProf. H. Maes
 Chief Scientist, ImecStanford UniversityStanford UniversitySr. VP Imec, Coordinator CALIT

kittlj@imec.be

hspwong@stanford.edu

nishiy@stanford.edu

maesh@imec.be

We recommend following hotels in Leuven: