Semicon West, San Francisco, CA  -- July 16, 2001  -- IMEC, Europe’s largest independent center for the research and development for design, semiconductor and communications technologies, has announced the start of a new 2-year program to develop a 0.18µm BiCMOS manufacturing process that will ease the manufacture of radio-frequency (RF) devices.

The goal of the IMEC industrial affiliation program (IIAP) is to develop a manufacturable, fully integrated 0.18µm BiCMOS process technology specifically for 2- and 5GHz RF applications with emphasis on the combination of low power and high performance. Specific attributes of the manufacturing process include besides a silicon germanium carbon (SiGeC) bipolar device, a core CMOS process with an n+/p+ analog 0.18µm technology, featuring shallow trench isolation, 3.5nm gate oxide thickness and cobalt-salicide. 

Professor Gilbert Declerck, President and CEO of IMEC, said, “RF technologies are essential to the success of next-generation wireless communications applications, including networks like Bluetooth.  This program will work to ensure that efficient manufacturing technologies are in place to support the most advanced products designed exactly when they are needed.”

The BiCMOS process will utilize a SiGeC heterojunction bipolar transistor (HBT) to attain superior RF performance at low current densities. The HBT consists of a quasi self-aligned emitter/base architecture with SiGeC base, deep trench isolation and in-situ arsenic doped poly-emitters. 

The technology will initially run in IMEC’s 200mm manufacturing pilot line with a copper/oxide back-end, and includes different types of poly resistors, double poly capacitors, varactors, inductors and double metal capacitors. 

Structured as a three-part development program, the IIAP has defined its milestones as HBT module development, BiCMOS process integration, and RF passive components.  During the first year, the main activities concentrate on design of a test chip for process development, process step and module development, and process assembly. The second year focuses on solving integration issues to achieve a fully integrated 0.18µm BiCMOS process by the end of 2002. 

The IMEC Industrial Affiliation Programs (IIAP)

IMEC’s industrial affiliation program (IIAP) formula is recognized worldwide as one of the most successful partnership schemes in research and development. The collaborations are based on shared costs and risks and are built on sound intellectual property rules. Ten IIAPs in other research fields are already in progress. 

About IMEC

IMEC was founded in 1984 and today is Europe's leading independent research center for the development and licensing of microelectronics, and information and communication technologies (ICT). IMEC is headquartered in Leuven, Belgium, and has a staff of more than 1000 people including more than 200 industrial residents. Its more than $100 million revenue is derived from agreements and contracts with Flemish government, the EC, MEDEA, the European Space Agency, equipment and material suppliers and semiconductor companies worldwide. IMEC's activities concentrate on design of integrated information and communication systems; silicon process technology; silicon technology and device integration; microsystems, components and packaging; advanced training in microelectronics. IMEC has a sub-0.25µm 200mm pilot line and is ISO9001 certified. News from IMEC is located at www.imec.be.

For more information:

Katrien Marent

Communication Manager

Public Relations and Marketing Communications

IMEC, Kapeldreef 75

B- 3001 Leuven, Belgium

Tel +32 16 28 18 80

Fax +32 16 28 16 37

Email: Katrien.Marent@imec.be