Leuven, Belgium, March 13, 2003 --- IMEC and International SEMATECH (ISMT) today signed an agreement to work together in an advanced technology program aimed at speeding the development of 157nm lithography. In parallel, several collaboration agreements between IMEC and leading IDMs are also under negotiation.

Although all major hurdles in the development of 157 nm lithography have been overcome, a process facilitated by ISMT’s early work in building the needed157 nm infrastructure, considerable work still lies ahead if 157 nm lithography is to be adopted in time. Important engineering efforts remain with respect to full-field imaging, uniform reticle and pellicle printability, and resist technology. 157 nm resist technology is now entering a stage of formulation and process development, but critical issues such as the delay stability, line edge roughness and etch resistance, need to be resolved before volume use for semiconductor device manufacturing will be feasible.

Much of the required work is planned to come out of the 157 nm IMEC industrial affiliation program  (IIAP) over the next few years. This program will ramp up to full speed in Q2 of this year, when the world’s first 157nm full-field scanner (ASML Micrascan VII) will become operational at IMEC. A consortium of IC manufacturers, equipment suppliers, as well as resist suppliers and mask shops has already been established.  International SEMATECH has agreed to join a major portion of this program.

IMEC’s program will build on the current state-of-the-art technology. Research will be carried out at IMEC by IMEC employees and industrial assignees from the partner companies and International SEMATECH on the following topics:

•         Hard pellicle printing: understanding and requirements for 65 nm imaging;

•         157 nm reticle handling with special attention to organic contamination removal (through 172 nm Ozone cleaning);

•         Monitoring procedures and contamination/purging requirements for stable 157 nm imaging on full-field scanners;

•         157 nm resist integration in process flows for critical 65nm node layers;

•         continuous 157 nm resist benchmarking;

•         157 nm reticle defect printability issues.

“A broad range of expertise in various fields is required to solve the significant engineering challenges posed by the development of 157 nm lithography”, said Dr. Luc Van den hove, Vice President of Silicon Process and Device Technology at IMEC. “While International SEMATECH’s programs focus primarily on infrastructure development and manufacturing considerations, IMEC distinguishes itself through its process module research. This agreement will guarantee complementary research work in 157 nm at both organizations, and ensure an open information exchange so that the development of 157 nm lithography will be as cost-effective and efficient as possible.”

“We’re pleased that ISMT’s pioneering work in building the infrastructure for 157nm lithography and forging industry consensus and direction has provided a solid foundation for IMEC’s 157nm program,” said Dr. Tony Yen, director of lithography at ISMT. “We’re looking forward to working with IMEC in this important program, and to realizing the benefits of IMEC’s expertise in process development.  This agreement recognizes the core competences of both organizations, and once again proves the value of cooperation.”

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Notes to editors

The IMEC Industrial Affiliation Programs (IIAP)

IMEC's industrial affiliation program (IIAP) formula is recognized worldwide as one of the most successful partnership schemes in research and development. The collaborations are based on shared costs and risks and are built on sound intellectual property rules.

About IMEC

IMEC was founded in 1984 and today is Europe’s largest independent research center in the field of microelectronics, nanotechnology, enabling design methods and technologies for ICT systems. IMEC's activities concentrate on the design technology for integrated information and communication systems; silicon process steps and modules, silicon processes; nanotechnology, microsystems, components and packaging; solar cells; and advanced training in microelectronics. IMEC is headquartered in Leuven, Belgium, and has a staff of more than 1250 people including over 380 industrial residents and guest researchers. Its revenue of more than 130Meuro is derived from agreements and contracts with the Flemish government and companies, equipment and material suppliers and semiconductor and system-oriented companies worldwide, the EC, MEDEA+ and ESA. News from IMEC is located at www.imec.be.

About International SEMATECH

International SEMATECH (ISMT) is a global semiconductor technology development consortium that has effectively represented the semiconductor manufacturing industry on innovation issues since 1988; its members are Agere Systems, AMD, Hewlett-Packard, IBM, Infineon, Intel, Motorola, Philips, Texas Instruments and TSMC.   ISMT conducts state-of-the-art research, and is a highly-regarded technology partner whose mission is to promote the interests common to all chipmakers.  It has extensive experience collaborating with equipment and materials suppliers, as well as government and academic research centers, to refine the tools and technology necessary to produce future generations of chips. Additional information may be found at www.sematech.org.

For more information:

Katrien Marent                                                                          

Corporate Communication Manager                                           

IMEC, Kapeldreef 75

B- 3001 Leuven, Belgium                                                          

Tel +32 16 28 18 80 Fax +32 16 28 16 37                                   

Email: Katrien.Marent@imec.be

Dan McGowan

Media Relations Manager

International SEMATECH

(512) 356-3440

Email: dan.mcgowan@sematech.org