最新消息
Archive 2008
First >100 Mbps mobile SDR baseband platform in processing
11/02/2008IMEC has completed design and tape-out of a flexible-air-interface (FLAI) baseband platform for software-defined radios (SDR). IMEC’s solution is an ideal basis to support upcoming generations of mobile devices featuring 802.11n, 802.16e, mobile TV and 3GPP-LTE communication standards. The system-on-chip (SoC) platform and its patented components with their programming environment will be licensed to industry for commercial product development as white-box intellectual property (IP).
The FLAI platform incorporates two IMEC-proprietary ADRES (architecture for dynamically reconfigurable embedded systems) baseband processors fully supported by a proprietary C-code compiler, three digital front-end tiles with a proprietary ASIP (application-specific integrated processor) to assure sync-detection, an ARM(TM)9 processor, and optimized AMBA(TM) interconnect to link the SoC’s modules with on-chip memories. The IP blocks come with reference platform control software and reference firmware for IEEE802.11n, 802.16e and 3GPP-LTE, as well as integration support.
Thanks to a patented platform control and power management approach, the SoC consumes only a few milliwatts in standby mode, yet is still capable of receiving an immediate burst from any supported wireless standard (reactive radio). When transmitting or receiving data bursts with multi-antenna encoding at more than 100Mbps, platform peak power is only 300mW.
IMEC also expects to combine its FLAI platform and flexible radio front-end (SCALDIO) in order to demonstrate a fully operational software-defined radio later this year. This platform achievement will be followed by a new generation of SDR research results, focusing on SDR and cognitive radio now under development. This new generation also includes a unified application-specific processor architecture that can reduce the area cost of implementing multi-mode advanced forward error correction.
FLAI Specifications
- 38 mm² die area
- Technology node: TSMC 90nm
- 4 power domains, 8 clocks<br>- 270 I/O pins
- 6.7 Mb memory (121 instances)
- 2 FLAI-ADRES processors, each with
- 33 memory macro @ 400MHz
- 32KB instruction cache
- 128-entries config mem
- 64KB data scratchpad
- 128KB IMEM @ 200MHz
- 400MHz WCC Clock rate
- 25,6GOPS
For more information:
Katrien Marent
Corporate Communication Manager
IMEC, Kapeldreef 75
B- 3001 Leuven, Belgium
Tel +32 16 28 18 80 Fax +32 16 28 16 37
Email: Katrien.Marent@imec.be





