Just Published: Issue 34 Future Fab International – click here to download!

Welcome to this the 34th issue of Future Fab. We are pleased to present to you a follow-up to something we first presented over three years ago when it was mostly just interesting research and a concept – 3D integration. We recognize that the reality of 3D is still limited in its applications and that there is much more to come in terms of developments from these exciting technologies. But we are much further along than we were three years ago, and in this issue you will see exactly how far we have come. For all of those who wanted to contribute but couldn’t meet the deadlines, you’ll have your chance in the next issue. We have decided to continue the theme in October – so stay tuned for more on 3D interconnect technology.