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You are here: Home :: 研發項目 :: Scaling-driven nanoelectronics :: Interconnections (back-end) :: New techniques - Copper metallization
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  • Scaling-driven nanoelectronics
    • Lithography
    • Transistors (front-end)
    • Interconnections (back-end)
    • 3D integration
    • Memory technology
    • New materials
    • Supporting expertise
  • CMORE - heterogeneous integration
  • Human++ - biomedical electronics
  • Wireless communication
  • Energy
  • NERF - Neuroelectronics Research Flanders
  • Organic electronics
  • Wireless autonomous transducer solutions

Scaling-driven nanoelectronics

Interconnections (back-end)

  • New materials - Cu/low-k
  • New techniques - double patterning lithography
  • New techniques - Copper metallization

Invent - To gain early insight in the metallization challenges of the 22-16nm technology, imec looks into creating and filling test trenches with widths down to 25nm.

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